About Me

Saad Been Mosharof is an NSF-supported Graduate Research Assistant and M.S. student in Mechanical Engineering at Tuskegee University, advised by Dr. Munshi M. Basit. He studies the thermo-mechanical reliability of microelectronic packaging, building finite-element models of package-on-package assemblies with bismuth-doped SAC solder joints under JEDEC-standard thermal-cycling and drop-shock loading, and is now extending this framework with physics-informed neural networks to predict solder-joint reliability.

In earlier work with Dr. Kazi Arafat Rahman at BUET, he developed a hybrid two-temperature model–molecular dynamics framework for femtosecond laser ablation of copper. He was also a faculty member in Mechanical Engineering at Shahjalal University of Science and Technology, Bangladesh.

He is seeking PhD opportunities beginning Fall 2027.

Recent Updates

1. Aug 2026: First-author manuscript on a refined TTM-MD model for ultrafast laser ablation of copper submitted to Modelling and Simulation in Materials Science and Engineering

2. Apr 2026: Presented a poster on Bi-doped solder-joint reliability at JARS 2026, Tuskegee University

3. Feb 2026: Two co-authored papers from ICME 2025 published on SSRN: coalescence-induced droplet jumping and hydrogen desorption in hyper-elastic polymer seals

4. Jan 2026: Joined Tuskegee University as a Graduate Research Assistant on an NSF-funded electronics-packaging reliability project